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TECHNOLOGY

Research Field

Taesung's challenge is on-going.

We, the tech-center of Taesung is making efforts to acquire
the exclusive technology competence
along with the changes on global PCB market.
Item Contents
Vacuum∙Binary DES line A unit ultra micro PCB by adopting the vacuum and binary for removing the obstacles (Puddling, side etching and etc.) to create the micro circuit in subtractive etching process and developing and minimizing the lamination before and after the etching
RtR horizontal plating line A roll to roll horizontal plating system for mass producing the micro circuit, FPCB with uniform cross-section by maximizing the advantages and amending the disadvantages of horizontal plating
Non-contact type
vertical developing line		 A non-contact type vertical developing unit for converting from subtractive to MSAP dependent to the board thinning, making the main board in substrate(SLP; Substrate-Like PCB) and engineering process not adopting the substrate(WLP; Wafer Level Package, PLP; Panel Level Package)
Ultra thin board scrubbing line
for RtR and sheet		 A mechanical scrubbing machine for surface processing on the ultra thin PCB, and a system for customized production of roll to roll board and sheet board depending on production conditionds