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产品信息

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非接触式显影机
产品介绍 用于载板线路板生产，实现高解析度与提升产能
产品特征 产品特征：采用非接触方式实现产品损伤最小化与提升工艺效率

技术指标

Classification Dry Film Developer Solder Resist Developer
Circuit board type Package Substrate
Size 403 X 508mm~415 X 512mm 
Thickness Min0.035mm(Cu 3/3) - Max 0.5mm
Hole dimension BVH (Min 50㎛) and PTH(Min 50㎛)
Circuit width 15㎛
Diameter 18,500(21,000)(L) X 5,500(W) X 2,600(H)
Process Loader → Buffer → Develop(2 zone) → Post Develop → Buffer → Resine5 Step → Buffer → Air Cut → Hot Dry → Unloader Loader → Buffer → Develop(3 zone) → Post Develop → Buffer → Resine2 Step → Soft Etching → Resine3 Step → Air Cut → Hot Dry → Unloader
Line Speed 1m/min~4m/min(STD 2m/min)
Track Time

Double Type : 45sec (1 PCB : 22.5sec)

Single Type : 35sec (1 PCB : 35sec)
Loader / Unloader 6- axis multi-joint robot
Conveying type Vertical Jig transfer
Production quantity

Double Type : 18,000㎡/month(22hr X 26Day)

Single Type : 12,000㎡/month(22hr X 26Day)
Tray loading capacity -61 pieces
Spray Pressure 1kg/㎠~2.0kg/㎠