PRODUCT INFO
정면기
비접촉 현상기 (TSG-NCD-200)
제품소개
Package 회로기판에 사용되는 수직현상기로 고해상도와 높은 생산성을 갖추 설비임
제품특징
NON-CONTACT 방식으로 기판 손상 최소화 및 공정 효율 제고
제원
| Classification | Dry Film Developer | Solder Resist Developer |
|---|---|---|
| Circuit board type | Package Substrate | |
| Size | 403 X 508mm~415 X 512mm | |
| Thickness | Min0.035mm(Cu 3/3) - Max 0.5mm | |
| Hole dimension | BVH (Min 50㎛) and PTH(Min 50㎛) | |
| Circuit width | 15㎛ | |
| Diameter | 18,500(21,000)(L) X 5,500(W) X 2,600(H) | |
| Process | Loader → Buffer → Develop(2 zone) → Post Develop → Buffer → Resine5 Step → Buffer → Air Cut → Hot Dry → Unloader | Loader → Buffer → Develop(3 zone) → Post Develop → Buffer → Resine2 Step → Soft Etching → Resine3 Step → Air Cut → Hot Dry → Unloader |
| Line Speed | 1m/min~4m/min(STD 2m/min) | |
| Track Time | Double Type : 45sec (1 PCB : 22.5sec) Single Type : 35sec (1 PCB : 35sec) |
|
| Loader / Unloader | 6- axis multi-joint robot | |
| Conveying type | Vertical Jig transfer | |
| Production quantity | Double Type : 18,000㎡/month(22hr X 26Day) Single Type : 12,000㎡/month(22hr X 26Day) |
|
| Tray loading capacity | -61 pieces | |
| Spray Pressure | 1kg/㎠~2.0kg/㎠ | |
